Average Power Handling Capability of Microstrip Passive Circuits Considering Metal Housing and Environment Conditions

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dc.contributorGrupo de Microondas y Electromagnetismo Computacional Aplicado (GMECA)es
dc.contributor.authorSánchez-Soriano, Miguel Ángel-
dc.contributor.authorQueré, Yves-
dc.contributor.authorLe Saux, Vincent-
dc.contributor.authorQuendo, Cédric-
dc.contributor.authorCadiou, Stephane-
dc.contributor.otherUniversidad de Alicante. Departamento de Física, Ingeniería de Sistemas y Teoría de la Señales
dc.date.accessioned2016-03-21T10:02:51Z-
dc.date.available2016-03-21T10:02:51Z-
dc.date.issued2014-10-
dc.identifier.citationIEEE Transactions on Components, Packaging and Manufacturing Technology. 2014, 4(10): 1624-1633. doi:10.1109/TCPMT.2014.2345100es
dc.identifier.issn2156-3950 (Print)-
dc.identifier.issn2156-3985 (Online)-
dc.identifier.urihttp://hdl.handle.net/10045/53912-
dc.description.abstractIn this paper, the average power handling capability (APHC) of microstrip passive circuits considering the metal housing and environment conditions is investigated in detail. A systematic method is proposed for the computation of the APHC of microstrip circuits in open and enclosed metal housing configurations, typically used in microwave components. The method also yields an estimate of the maximum temperature in a microstrip circuit for a given input power. Closed-form equations accounting for external conditions, such as convection or radiation heat transfer are given to evaluate the APHC. For validation, two microstrip bandstop filters centered at 10 GHz are analyzed following the proposed model, and the results are compared with those simulated showing a good agreement. In addition, both circuits are fabricated and characterized. Thermal profile measurements are provided, confirming the predicted results. The effect of the topology layout and the electromagnetic performance on the APHC are also discussed.es
dc.description.sponsorshipThis work was supported by the Euripides European Project MIDIMU-HD.es
dc.languageenges
dc.publisherIEEEes
dc.rights© 2014 IEEEes
dc.subjectAverage power handling capability (APHC)es
dc.subjectElectrothermal analysises
dc.subjectMetal housinges
dc.subjectMicrowave deviceses
dc.subjectPlanar circuitses
dc.subjectPower applicationses
dc.subject.otherTeoría de la Señal y Comunicacioneses
dc.titleAverage Power Handling Capability of Microstrip Passive Circuits Considering Metal Housing and Environment Conditionses
dc.typeinfo:eu-repo/semantics/articlees
dc.peerreviewedsies
dc.identifier.doi10.1109/TCPMT.2014.2345100-
dc.relation.publisherversionhttp://dx.doi.org/10.1109/TCPMT.2014.2345100es
dc.identifier.cvIDA7951089-
dc.rights.accessRightsinfo:eu-repo/semantics/restrictedAccesses
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