Surface, Thermal and Antimicrobial Release Properties of Plasma-Treated Zein Films

Please use this identifier to cite or link to this item:
Información del item - Informació de l'item - Item information
Title: Surface, Thermal and Antimicrobial Release Properties of Plasma-Treated Zein Films
Authors: Pankaj, Shashi Kishor | Bueno Ferrer, Carmen | Misra, N.N. | O'Neill, Luke | Jiménez, Alfonso | Bourke, Paula | Cullen, P.J.
Research Group/s: Análisis de Polímeros y Nanomateriales
Center, Department or Service: Universidad de Alicante. Departamento de Química Analítica, Nutrición y Bromatología
Keywords: Non-thermal plasma | DBD plasma | Antimicrobial packaging | Zein | Thymol | Release kinetics
Knowledge Area: Química Analítica
Issue Date: Mar-2014
Publisher: Scrivener Publishing
Citation: Journal of Renewable Materials. 2014, 2(1): 77-84. doi:10.7569/JRM.2013.634129
Abstract: The effects of dielectric barrier discharge plasma treatment on zein film containing thymol as an active ingredient were evaluated. The plasma discharge was optically characterized to identify the reactive species. A significant increase in the film roughness (p < 0.05) was observed due to the etching effect of DBD plasma, which was correlated with the increase in the diffusion rate of thymol in the food simulant. The diffusion of thymol from the zein film was measured in aqueous solution. The kinetics of thymol release followed the Fick’s law of diffusion as shown by the high correlation coefficients between experimental and theoretical data. No significant change (p > 0.05) was observed for the thermal properties of the antimicrobial films after DBD plasma treatment.
ISSN: 2164-6325 (Print) | 2164-6341 (Online)
DOI: 10.7569/JRM.2013.634129
Language: eng
Type: info:eu-repo/semantics/article
Peer Review: si
Publisher version:
Appears in Collections:INV - NANOBIOPOL - Artículos de Revistas

Files in This Item:
Files in This Item:
File Description SizeFormat 
Thumbnail2014_Pankaj_etal_JRM.pdfPreprint (acceso abierto)468,2 kBAdobe PDFOpen Preview

Items in RUA are protected by copyright, with all rights reserved, unless otherwise indicated.