Fabrication of Micro-Perforated Panel (MPP) sound absorbers using Digital Light Processing (DLP) 3D printing technology

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Título: Fabrication of Micro-Perforated Panel (MPP) sound absorbers using Digital Light Processing (DLP) 3D printing technology
Autor/es: Carbajo, Jesús | Nam, Sang-Hoon | Fang, Nicholas X.
Grupo/s de investigación o GITE: Acústica Aplicada
Centro, Departamento o Servicio: Universidad de Alicante. Departamento de Física, Ingeniería de Sistemas y Teoría de la Señal
Palabras clave: Sound absorption | Micro-Perforated Panel (MPP) | Additive manufacturing (AM) | Digital Light Processing (DLP) technology
Fecha de publicación: 1-dic-2023
Editor: Elsevier
Cita bibliográfica: Applied Acoustics. 2024, 216: 109788. https://doi.org/10.1016/j.apacoust.2023.109788
Resumen: The fabrication of Micro-Perforated Panels (MPPs) still constitutes a challenge to the acoustic materials industry because it usually requires expensive manufacturing techniques to obtain holes of submillimetre size. In this context, the rise of additive manufacturing or 3D printing (3DP) technologies over the last years has paved the way for the design and development of new materials at the microscopic scale. Among these, Digital Light Processing (DLP) technology emerges as an excellent option due to its advantages in terms of printing speed and higher accuracy when compared to traditional additive manufacturing technologies. This work demonstrates the capacity of DLP technology to fabricate MPPs and explores its design possibilities by using different exposure times in the manufacturing process to attain different hole sizes. To this end, several MPP specimens were fabricated and tested when used as a resonator system in an impedance tube setup to determine their sound absorption performance, the experimental data showing a good agreement when compared to predictions obtained using the Maa model. Preliminary results highlight the potential capabilities of DLP and encourage its use in the design stage of these acoustics resonator systems.
Patrocinador/es: The conception of this research work took place at the Department of Mechanical Engineering at the Massachusetts Institute of Technology with support from the University of Alicante (Grant ACIE20-04).
URI: http://hdl.handle.net/10045/138966
ISSN: 0003-682X (Print) | 1872-910X (Online)
DOI: 10.1016/j.apacoust.2023.109788
Idioma: eng
Tipo: info:eu-repo/semantics/article
Derechos: © 2023 The Author(s). Published by Elsevier Ltd. This is an open access article under the CC BY-NC-ND license (http://creativecommons.org/licenses/by-nc-nd/4.0/).
Revisión científica: si
Versión del editor: https://doi.org/10.1016/j.apacoust.2023.109788
Aparece en las colecciones:INV - Acústica Aplicada - Artículos de Revistas

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