Thermogravimetric study of the decomposition of printed circuit boards from mobile phones

Please use this identifier to cite or link to this item: http://hdl.handle.net/10045/40242
Full metadata record
Full metadata record
DC FieldValueLanguage
dc.contributorResiduos, Pirólisis y Combustiónes
dc.contributor.authorOrtuño García, Nuria-
dc.contributor.authorMoltó Berenguer, Julia-
dc.contributor.authorEgea Ruiz, Silvia-
dc.contributor.authorFont, Rafael-
dc.contributor.authorConesa, Juan A.-
dc.contributor.otherUniversidad de Alicante. Departamento de Ingeniería Químicaes
dc.date.accessioned2014-09-12T10:40:09Z-
dc.date.available2014-09-12T10:40:09Z-
dc.date.issued2013-09-
dc.identifier.citationJournal of Analytical and Applied Pyrolysis. 2013, 103: 189-200. doi:10.1016/j.jaap.2012.12.020es
dc.identifier.issn0165-2370 (Print)-
dc.identifier.issn1873-250X (Online)-
dc.identifier.urihttp://hdl.handle.net/10045/40242-
dc.description.abstractThermal decomposition of printed circuits boards (PCB) is studied, using thermogravimetric analysis to compare the thermal behavior of PCB of mobile phones before and after the removal of the metallic fraction by acid washing. Several dynamic and dynamic + isothermal runs have been carried out at different heating rates (5, 10 and 20 K min−1), from room temperature to more than 1100 K. Also runs in the presence and in the absence of oxygen were performed (combustion and pyrolysis runs). Moreover, TG–MS experiments were performed (both in inert and oxidizing atmosphere) in order to better understand the thermal decomposition of these wastes and identify some compounds emitted during the controlled heating of these materials. Different reaction models are proposed, one for pyrolysis and one for combustion of the two kinds of wastes studied, which proved to simulate appropriately the experimental results at all the heating rates simultaneously.es
dc.description.sponsorshipSupport for this work was provided by the Generalitat Valenciana (Spain), research project Prometeo/2009/043/FEDER, and by the Spanish MCT, research project CTQ2008-05520.es
dc.languageenges
dc.publisherElsevieres
dc.subjectPyrolysises
dc.subjectCombustiones
dc.subjectKineticses
dc.subjectThermogravimetryes
dc.subjectPrinted circuit boardes
dc.subject.otherIngeniería Químicaes
dc.titleThermogravimetric study of the decomposition of printed circuit boards from mobile phoneses
dc.typeinfo:eu-repo/semantics/articlees
dc.peerreviewedsies
dc.identifier.doi10.1016/j.jaap.2012.12.020-
dc.relation.publisherversionhttp://dx.doi.org/10.1016/j.jaap.2012.12.020es
dc.rights.accessRightsinfo:eu-repo/semantics/openAccesses
dc.relation.projectIDinfo:eu-repo/grantAgreement/MICINN//CTQ2008-05520-
Appears in Collections:INV - REMAN - Artículos de Revistas
INV - I4CE - Artículos de Revistas

Files in This Item:
Files in This Item:
File Description SizeFormat 
Thumbnail2013_Ortuno_etal_JAAP_final.pdfVersión final (acceso restringido)2,08 MBAdobe PDFOpen    Request a copy
Thumbnail2013_Ortuno_etal_JAAP.pdfVersión revisada (acceso abierto)870,38 kBAdobe PDFOpen Preview


Items in RUA are protected by copyright, with all rights reserved, unless otherwise indicated.