Study on Multipactor Breakdown in Coaxial to Microstrip Transitions

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Title: Study on Multipactor Breakdown in Coaxial to Microstrip Transitions
Authors: Sánchez-Soriano, Miguel Ángel | Marini, Stephan | Vague, Joaquin | Gómez, Celia | Quesada Pereira, Fernando | Álvarez Melcón, Alejandro | Boria Esbert, Vicente Enrique | Gulglielmi, Marco
Research Group/s: Grupo de Microondas y Electromagnetismo Computacional Aplicado (GMECA)
Center, Department or Service: Universidad de Alicante. Departamento de Física, Ingeniería de Sistemas y Teoría de la Señal
Keywords: Coaxial to microstrip transition | High power applications | Multipactor | Power breakdown threshold
Knowledge Area: Electromagnetismo | Teoría de la Señal y Comunicaciones
Issue Date: 30-Oct-2018
Publisher: IEEE
Citation: Sánchez-Soriano, Miguel A., et al. “Study on Multipactor Breakdown in Coaxial to Microstrip Transitions”. In: 2018 IEEE MTT-S International Conference on Numerical Electromagnetic and Multiphysics Modeling and Optimization (NEMO), ISBN 978-1-5090-4837-3, 4 p.
Abstract: The objective of this paper is to study multipactor breakdown in coaxial to microstrip transitions. This kind of transitions generally exhibit a gap just below the central pin of the coaxial connector. This gap can create a region where the electric fields are relatively strong so that an electron path may be created that could potentially lead to a multipactor breakdown. In this paper, we study the multipactor modes which may be induced as a function of structural parameters, such as the substrate thickness and the gap length. In particular, it is found that two kinds of electron trajectory can be created leading to critical power levels that are even lower than those obtained with the parallel-plate model, generally used as a conservative model. In this context, we demonstrate that multipactor breakdown can happen for input power levels lower than 500 W. This, in turn, may become a critical issue for the use of classic coaxial to microstrip transitions in new high power satellites whenever payloads are manufactured using planar technology.
Sponsor: This work has been supported by the “Agencia Estatal de Investigación (AEI)” and by the EU through the ”Fondo Europeo de Desarrollo Regional -FEDER- Una manera de hacer Europa (AEI/FEDER, UE)”, under the coordinated research project TEC2016-75934-C4, and by the University of Alicante under the research project GRE16-17.
URI: http://hdl.handle.net/10045/83767
ISBN: 978-1-5090-4837-3
DOI: 10.1109/NEMO.2018.8503424
Language: eng
Type: info:eu-repo/semantics/conferenceObject
Rights: © 2017 IEEE
Peer Review: si
Publisher version: https://doi.org/10.1109/NEMO.2018.8503424
Appears in Collections:INV - GMECA - Comunicaciones a Congresos, Conferencias, etc.

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