Copper underpotential deposition at gold surfaces in contact with a deep eutectic solvent: New insights

Please use this identifier to cite or link to this item:
Información del item - Informació de l'item - Item information
Title: Copper underpotential deposition at gold surfaces in contact with a deep eutectic solvent: New insights
Authors: Sebastián, Paula | Gómez, Elvira | Climent, Victor | Feliu, Juan M.
Research Group/s: Electroquímica de Superficies
Center, Department or Service: Universidad de Alicante. Departamento de Química Física | Universidad de Alicante. Instituto Universitario de Electroquímica
Keywords: Single crystal | Deep eutectic solvent | Interface | Underpotential deposition | Chloride
Knowledge Area: Química Física
Issue Date: May-2017
Publisher: Elsevier
Citation: Electrochemistry Communications. 2017, 78: 51-55. doi:10.1016/j.elecom.2017.03.020
Abstract: The electrodeposition of copper on a polycrystalline gold electrode and on Au(hkl) single crystals was investigated in a deep eutectic solvent (DES). The DES employed consisted of a mixture of choline chloride and urea (1:2). The Au(hkl)/DES interface was studied using cyclic voltammetry in the capacitive region. The blank voltammograms showed characteristic features, not previously reported, that demonstrate the surface sensitivity of this solvent. Copper electrodeposition was then studied and it was found that this takes place through the formation of an underpotential deposition (UPD) adlayer, demonstrating the surface sensitivity of this process. Voltammetric profiles showed similarities with those obtained in aqueous solutions containing chloride, suggesting that the copper UPD in this DES is strongly influenced by the presence of chloride.
Sponsor: Financial support from MINECO through projects CTQ2016-76221-P (AEI/FEDER, UE) and TEC2014-51940-C2-2-R (AEI/FEDER, UE) are greatly acknowledged. P. Sebastian also acknowledges MECD for FPU grant.
ISSN: 1388-2481 (Print) | 1873-1902 (Online)
DOI: 10.1016/j.elecom.2017.03.020
Language: eng
Type: info:eu-repo/semantics/article
Rights: © 2017 Elsevier B.V.
Peer Review: si
Publisher version:
Appears in Collections:INV - EQSUP - Artículos de Revistas

Files in This Item:
Files in This Item:
File Description SizeFormat 
Thumbnail2017_Sebastian_etal_ElectrComm_final.pdfVersión final (acceso restringido)355,15 kBAdobe PDFOpen    Request a copy
Thumbnail2017_Sebastian_etal_ElectrComm_accepted.pdfAccepted Manuscript (acceso abierto)840,47 kBAdobe PDFOpen Preview

Items in RUA are protected by copyright, with all rights reserved, unless otherwise indicated.