Effect of Temperature, Atmosphere and Metals on the Thermal Degradation of Printed Circuit Boards

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Title: Effect of Temperature, Atmosphere and Metals on the Thermal Degradation of Printed Circuit Boards
Authors: Ortuño García, Nuria | Conesa, Juan A. | Moltó Berenguer, Julia | Font, Rafael
Research Group/s: Residuos, Pirólisis y Combustión
Center, Department or Service: Universidad de Alicante. Departamento de Ingeniería Química | Universidad de Alicante. Instituto Universitario de Ingeniería de los Procesos Químicos
Keywords: Printed circuit board | Pyrolysis | Combustion | Dioxin
Knowledge Area: Ingeniería Química
Issue Date: 2014
Publisher: Federal Environmental Agency
Citation: Organohalogen Compounds. 2014, 76: 194-197
Abstract: The permanent expansion of the market of electrical and electronic equipment (EEE) and the shorter innovation cycles, lead to a faster replacement of these appliances, making EEE a fast-growing source of waste (WEEE). As stated in Directive 2012/19/EU1 on waste electrical and electronic equipment, the content of hazardous components in EEE is a major concern during the waste management phase, and recycling of WEEE is not currently undertaken to a sufficient extent, resulting in a loss of valuable resources.
Sponsor: Support for this work was provided by: Ministry of Education and Science (Spain) (CTQ2008-05520 project); Valencian Community Government (Spain) (PROMETEO/2009/043/FEDER project).
URI: http://hdl.handle.net/10045/44928
ISSN: 1026-4892
Language: eng
Type: info:eu-repo/semantics/article
Rights: © Organohalogen Compounds
Peer Review: si
Appears in Collections:INV - REMAN - Artículos de Revistas

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