Thermogravimetric study of the decomposition of printed circuit boards from mobile phones

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Title: Thermogravimetric study of the decomposition of printed circuit boards from mobile phones
Authors: Ortuño García, Nuria | Moltó Berenguer, Julia | Egea Ruiz, Silvia | Font, Rafael | Conesa, Juan A.
Research Group/s: Residuos, Pirólisis y Combustión
Center, Department or Service: Universidad de Alicante. Departamento de Ingeniería Química
Keywords: Pyrolysis | Combustion | Kinetics | Thermogravimetry | Printed circuit board
Knowledge Area: Ingeniería Química
Issue Date: Sep-2013
Publisher: Elsevier
Citation: Journal of Analytical and Applied Pyrolysis. 2013, 103: 189-200. doi:10.1016/j.jaap.2012.12.020
Abstract: Thermal decomposition of printed circuits boards (PCB) is studied, using thermogravimetric analysis to compare the thermal behavior of PCB of mobile phones before and after the removal of the metallic fraction by acid washing. Several dynamic and dynamic + isothermal runs have been carried out at different heating rates (5, 10 and 20 K min−1), from room temperature to more than 1100 K. Also runs in the presence and in the absence of oxygen were performed (combustion and pyrolysis runs). Moreover, TG–MS experiments were performed (both in inert and oxidizing atmosphere) in order to better understand the thermal decomposition of these wastes and identify some compounds emitted during the controlled heating of these materials. Different reaction models are proposed, one for pyrolysis and one for combustion of the two kinds of wastes studied, which proved to simulate appropriately the experimental results at all the heating rates simultaneously.
Sponsor: Support for this work was provided by the Generalitat Valenciana (Spain), research project Prometeo/2009/043/FEDER, and by the Spanish MCT, research project CTQ2008-05520.
URI: http://hdl.handle.net/10045/40242
ISSN: 0165-2370 (Print) | 1873-250X (Online)
DOI: 10.1016/j.jaap.2012.12.020
Language: eng
Type: info:eu-repo/semantics/article
Peer Review: si
Publisher version: http://dx.doi.org/10.1016/j.jaap.2012.12.020
Appears in Collections:INV - REMAN - Artículos de Revistas

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